Core Technologies

Best Solution For Lighting

R&D Technology

Exellent Luminous Efficiency and Thermal Conductity

Using the excellent heat transfer characteristics of transparent ceramics (thermal conductivity~40 W/mK), and matching coefficient of thermal expansion (coefficient of thermal expansion~6-10, CTE) to evenly coated on both sides of phosphor technology (Conformal coating). As well as the development of anti-reflective film (Anti-reflection coating, ARC) makes LED chip to increase 20% more efficiency than posted film type LED and integrated type LED in operation of light existing.

Due to achieved increasing external quantum efficiency and relatively reduced the heat of chip layer, a nd it could develop self-radiation type of lamp or pendant when operating under 3W. LeTES series products of features are high lm/W, therefore it can easily develop out 3W 400~500lm light source in cold state. LeDiamond Opto presents the competitive packaging technology of such outstanding performance LED components, and creating the unique thinking from industry.

Advanced phosphor and integration of wafer-level packaging technology.

In the wafer level packaging technology, LeDiamond first time uses photoelectric chip packaging technology for integrating Upstream and downstream technology which is combining the Level 0 – 2 (Refer to the flow chart in the right). For example, if there is a new developing lamp company, it just needs to use LeDiamond light engine then to easily manufacture many desired light products. For a professional lighting design firm, LeDiamond Optoelectronics may give excellent customizing technology with customers to make unique and excellent lighting affection. LeTES series product (160lm / W 2700K CRI80) can easily reach to hot state 110lm / W in the loss of containing optical and circuit.

LeDiamond phosphor technology relative from 2400-10000K color temperature and 65-98 color rendering index (CRI), the uniformity of light color are can be adjusted according to customer needs, and with American National Standards Institute (ANSI ) separations standards for all kinds of color bin.

7 Stages Of LED Lighting Products

Level 0Production process of Epitaxy wafer and chip
Level 1LED chip package
Level 2LED Light Engine
Level 3Optical system
Level 4Circuit system
Level 5Product Structure
Level 6Lighting system

Outstanding Products & Key scheme

In addition to dazzling appearance, LeDiamond also provides services of cost savings and safety regulations of designing. Related application and design have carried out in Taiwan, the United States, Europe, and other 4 countries for 6 to 8 patents, and 8 to 10 new layouts and new design patents to protect customers' lighting products and LeDiamond technology.

Entire Lamp Designing Has The Following 4 Features

Save Cost
No heatsink can save the heat dissipation cost of lamps
Safety
Using the non-isolated circuit solves the problem of safety easily
Light
Omni-directional light source
High Efficiency
The highest lm/W compared to traditional LED package